Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Dynamic optimisation and model predictive control (MPC) are at the forefront of modern process systems engineering, offering robust methodologies to address the challenges posed by time-varying ...
A new technical paper titled “Non-Traditional Design of Dynamic Logics using FDSOI for Ultra-Efficient Computing” was published by researchers at University of Stuttgart, UC Berkeley, Indian Institute ...
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